原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the successful qualification of Samsung’s automotive LPDDR4X memory for use with the Snapdragon® Digital Chassis™ from Qualcomm Technologies, Inc. The LPD…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leaders…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung’s eighth-generation V-NAND (V8) technology, the…
三星电子宣布已完成业界最快10.7Gbps LPDDR5X DRAM的验证，该产品将用于联发科下一代Dimensity平台。此次验证基于三星LPDDR5X 16GB封装，在联发科即将发布的旗舰Dimensity 9400 SoC上完成，双方在三个月内完成合作验证。三星称该LPDDR5X功耗和性能较上代提升超25%，可延长移动设备续航并增强端侧AI性能。
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer…
三星电子发布ISOCELL HP9、GNJ和JN5三款面向智能手机主摄与副摄的图像传感器。其中HP9为业界首款2亿像素长焦传感器，采用1/1.4英寸光学格式，光敏度较前代提升12%、自动对焦对比度提升10%。GNJ为5000万像素双像素传感器，4K 60fps视频模式下功耗较前代改善34%。
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully built a Compute Express Link™ (CXL™) infrastructure certified by Red Hat, the world’s leading…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s D…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in th…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second (Gbps). Leveraging 1…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has started sampling its 256-gigabyte (GB)1 SD Express2 microSD card with sequential read speed of up to 800 megabytes per second (MB/s) and has c…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung’s HBM3E 12H provides an all-…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This init…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of SSD 990 EVO — the newest addition to the company’s lineup of consumer SSDs — which delivers powerful performance with better energy efficienc…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link™ (CXL™) memory operations in a real user environment with open-so…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D and a global shutter sensor, the ISOCELL Vizion 931. First in…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled the T5 EVO, a lightweight portable Solid-State Drive (SSD) that provides up to 8 terabytes (TB) of capacity, which is the largest capacity size curren…
原文摘录：Samsung Electronics today opened the Samsung AI Forum, at which it shared the latest research achievements in artificial intelligence (AI) and computer engineering (CE), contributing to enhancing the company’s next-generation semiconductor…
原文摘录：Samsung Electronics first launched its 200-Megapixel (MP) Image Sensor in 2021. Since then, the company has been leading the ultra-high-megapixel industry by continuously launching new products and working tirelessly to drive further innov…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — i…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer proc…
原文摘录：Samsung Electronics today announced that it will host the Samsung AI Forum 2023 on November 7 at the Suwon Convention Center in Gyeonggi-do, Korea. The forum serves as a platform to showcase the latest research achievements in artificial i…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest innovations in analog and logic semiconductor technologies and outlined its blueprint for upcoming technological advancements at its inaugu…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM1 marke…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of a new 4-terabyte (TB) offering in its SSD 990 PRO series. The 990 PRO series is a lineup of high-performance PCIe1 4.0 SSDs powered by Samsun…
原文摘录：Samsung Electronics, Samsung Display and Samsung SDI today jointly announced their collaborative presence at the highly anticipated IAA MOBILITY1 2023 event, scheduled for Sept. 5-10 in Munich, Germany. In a united effort, the three Samsun…
三星电子宣布开发出业界首款、容量最高的12纳米级32Gb DDR5 DRAM，此前已于2023年5月开始量产12纳米级16Gb DDR5 DRAM。该产品在相同封装尺寸下容量为16Gb DDR5的两倍，128GB模块无需TSV工艺即可生产，功耗较采用16Gb DRAM的128GB模块降低约10%。三星计划在今年年底前开始量产该12纳米级32Gb DDR5 DRAM。
推荐理由：三星披露12纳米级32Gb DDR5 DRAM开发进展与量产时间表，可用于跟踪高容量DRAM技术路线与数据中心能效诉求。
三星电子发布旗舰UHS-I存储卡PRO Ultimate，提供microSD和全尺寸SD两种规格，容量最高512GB，顺序读取速度最高200MB/s、写入130MB/s。新品搭载28nm控制器，能效较55nm控制器提升37%，并具备防水、防摔、耐温等七重防护及十年有限保修。microSD版本即日起全球上市，SD版本将于2023年10月上市。
三星电子宣布已完成业界首款GDDR7 DRAM的开发，今年将率先搭载于主要客户的下一代系统进行验证。该产品为16Gb容量，带宽达1.5TBps、每引脚速率最高32Gbps，采用PAM3信号方式，能效较GDDR6提升20%，热阻降低70%。三星表示将根据行业需求推向市场。
推荐理由：三星披露GDDR7完成开发及带宽、能效、封装等参数，可了解下一代显存标准的技术路线与客户验证节奏。
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution optimized for in-vehicle infotainment (…