Federal Reserve issues FOMC statement
原文摘录：Federal Reserve issues FOMC statement
全部股票动态
美联储 · 货币政策
美联储 · 货币政策 Minutes of the Board’s discount rate meetings on February 9 and March 18, 2026
原文摘录：Minutes of the Board’s discount rate meetings on February 9 and March 18, 2026
Rapidus · 官方新闻 Rapidus Opens Analysis Center and Rapidus Chiplet SolutionsNew facilities enhance Rapidus’ development environment to e…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
Rapidus · 官方新闻 NEDO Approves Rapidus’ FY2026 Plan and Budget for 2nm Semiconductor Projects Approval covers “Research and Development…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
美联储 · 货币政策 Minutes of the Federal Open Market Committee, March 17–18, 2026
原文摘录：Minutes of the Federal Open Market Committee, March 17–18, 2026
三星电子 · 半导体官方新闻精选AI 评分6060 三星与AMD签署谅解备忘录，扩大下一代AI存储合作
三星电子宣布与AMD签署谅解备忘录，扩大在下一代AI存储与计算技术上的战略合作。根据备忘录，双方将就下一代AMD AI加速器Instinct MI455X GPU的主要HBM4供应，以及代号“Venice”的第6代AMD EPYC CPU所用先进DRAM方案进行对接。
推荐理由：三星与AMD签署谅解备忘录，明确HBM4与DDR5供应方向并提及代工合作讨论，可观察AI存储供应链的绑定进展与阶段约束。
三星电子 · 半导体官方新闻 Samsung Unveils HBM4E, Showcasing Comprehensive AI Solutions, NVIDIA Partnership and Vision at NVIDIA GTC 2026
原文摘录：Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’…
三星电子 · 半导体官方新闻 Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the indu…
三星电子 · 半导体官方新闻 Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory
原文摘录：Samsung Electronics today announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing. By deploying more t…
三星电子 · 半导体官方新闻精选AI 评分6262 三星电子举行新半导体研发综合体NRD-K设备搬入仪式
三星电子宣布在其器兴园区为新半导体研发综合体NRD-K举行设备搬入仪式，该综合体2022年动工，将作为存储、System LSI和晶圆代工研发基地。三星计划到2030年为此投资约20万亿韩元，占地约10.9万平方米，其中研发专用产线计划于2025年年中开始运营。
推荐理由：三星披露其新建半导体研发综合体NRD-K的设备搬入节点、投资规模与专用产线投运时间，可用于跟踪其下一代存储与代工研发节奏。
三星电子 · 半导体官方新闻 Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has developed the industry’s first 24-gigabit (Gb) GDDR71 DRAM. In addition to the industry’s highest capacity, the GDDR7 features the fastest speed, p…
三星电子 · 半导体官方新闻AI 评分4848 三星电子开始量产面向AI应用的PM9E1 PCIe 5.0 SSD
三星电子宣布已开始量产PM9E1，这是一款采用自研5纳米控制器和第八代V-NAND的PCIe 5.0 SSD，顺序读写速度分别达14.5GB/s和13GB/s，较上代提升逾一倍。该产品提供512GB至4TB容量选项，功耗效率提升超50%，并应用SPDM v1.2安全技术。三星计划以PM9E1为起点向全球PC厂商扩展先进SSD供应。
三星电子 · 半导体官方新闻 Samsung Launches 990 EVO Plus SSD With Best-in-Class Performance Speeds Supported by PCIe 4.0
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of the 990 EVO Plus, adding to its lineup of leading SSD products. With PCIe 4.0 support and latest NAND technology, the 990 EVO Plus is an id…
三星电子 · 半导体官方新闻 Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). With industry-leading speeds…
三星电子 · 半导体官方新闻 Samsung Begins Industry’s First Mass Production of QLC 9th-Gen V-NAND for AI Era
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass productio…
三星电子 · 半导体官方新闻 Samsung Announces Work With Qualcomm To Support Premium In-Vehicle Infotainment and Advanced Driver Assistance Systems
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the successful qualification of Samsung’s automotive LPDDR4X memory for use with the Snapdragon® Digital Chassis™ from Qualcomm Technologies, Inc. The LPD…
三星电子 · 半导体官方新闻 Samsung Electronics Begins Mass Production of Industry’s Thinnest LPDDR5X DRAM Packages for On-Device AI
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leaders…
三星电子 · 半导体官方新闻 Samsung Electronics Launches Enhanced 1TB microSD Cards With Improved Performance and Higher Capacity
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung’s eighth-generation V-NAND (V8) technology, the…
三星电子 · 半导体官方新闻AI 评分4545 三星电子完成业界最快LPDDR5X验证，将用于联发科旗舰移动平台
三星电子宣布已完成业界最快10.7Gbps LPDDR5X DRAM的验证，该产品将用于联发科下一代Dimensity平台。此次验证基于三星LPDDR5X 16GB封装，在联发科即将发布的旗舰Dimensity 9400 SoC上完成，双方在三个月内完成合作验证。三星称该LPDDR5X功耗和性能较上代提升超25%，可延长移动设备续航并增强端侧AI性能。
三星电子 · 半导体官方新闻 Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Netwo…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer…
三星电子 · 半导体官方新闻AI 评分2222 三星发布ISOCELL HP9、GNJ、JN5三款手机图像传感器
三星电子发布ISOCELL HP9、GNJ和JN5三款面向智能手机主摄与副摄的图像传感器。其中HP9为业界首款2亿像素长焦传感器，采用1/1.4英寸光学格式，光敏度较前代提升12%、自动对焦对比度提升10%。GNJ为5000万像素双像素传感器，4K 60fps视频模式下功耗较前代改善34%。
三星电子 · 半导体官方新闻 Samsung Electronics Announces Successful Building of Industry-First CXL Infrastructure Certified by Red Hat
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully built a Compute Express Link™ (CXL™) infrastructure certified by Red Hat, the world’s leading…
三星电子 · 半导体官方新闻 Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s D…
三星电子 · 半导体官方新闻 Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in th…
三星电子 · 半导体官方新闻 Samsung Develops Industry’s Fastest 10.7Gbps LPDDR5X DRAM, Optimized for AI Applications
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second (Gbps). Leveraging 1…
三星电子 · 半导体官方新闻 Samsung’s New microSD Cards Bring High Performance and Capacity for the New Era in Mobile Computing and On-Device AI
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has started sampling its 256-gigabyte (GB)1 SD Express2 microSD card with sequential read speed of up to 800 megabytes per second (MB/s) and has c…
三星电子 · 半导体官方新闻 Samsung Develops Industry-First 36GB HBM3E 12H DRAM
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung’s HBM3E 12H provides an all-…
三星电子 · 半导体官方新闻 Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This init…
三星电子 · 半导体官方新闻 Samsung Launches SSD 990 EVO: Elevating Performance for Everyday Gaming, Business and Creative Workflows
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of SSD 990 EVO — the newest addition to the company’s lineup of consumer SSDs — which delivers powerful performance with better energy efficienc…
三星电子 · 半导体官方新闻 Samsung Electronics and Red Hat Partnership To Lead Expansion of CXL Memory Ecosystem With Key Milestone
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link™ (CXL™) memory operations in a real user environment with open-so…
三星电子 · 半导体官方新闻 Samsung Unveils Two New ISOCELL Vizion Sensors Tailored for Robotics and XR Applications
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D and a global shutter sensor, the ISOCELL Vizion 931. First in…
三星电子 · 半导体官方新闻 Samsung Unveils New Portable SSD T5 EVO That Offers 8TB Capacity in a Compact Design
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled the T5 EVO, a lightweight portable Solid-State Drive (SSD) that provides up to 8 terabytes (TB) of capacity, which is the largest capacity size curren…
三星电子 · 半导体官方新闻 Samsung Electronics Opens Samsung AI Forum 2023, Showcasing Key Advancements in AI and Computer Engineering
原文摘录：Samsung Electronics today opened the Samsung AI Forum, at which it shared the latest research achievements in artificial intelligence (AI) and computer engineering (CE), contributing to enhancing the company’s next-generation semiconductor…
三星电子 · 半导体官方新闻 Samsung Electronics Introduces ISOCELL Zoom Anyplace & E2E AI Remosaic Solutions for the 200-Megapixel Image Sensor
原文摘录：Samsung Electronics first launched its 200-Megapixel (MP) Image Sensor in 2021. Since then, the company has been leading the ultra-high-megapixel industry by continuously launching new products and working tirelessly to drive further innov…
三星电子 · 半导体官方新闻 Samsung Electronics Holds Memory Tech Day 2023 Unveiling New Innovations To Lead the Hyperscale AI Era
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — i…
三星电子 · 半导体官方新闻 Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer proc…
三星电子 · 半导体官方新闻 Samsung Electronics To Host AI Forum 2023 Highlighting AI and Computer Engineering Innovation
原文摘录：Samsung Electronics today announced that it will host the Samsung AI Forum 2023 on November 7 at the Suwon Convention Center in Gyeonggi-do, Korea. The forum serves as a platform to showcase the latest research achievements in artificial i…
三星电子 · 半导体官方新闻 Samsung Showcases Groundbreaking Logic Innovations at System LSI Tech Day 2023
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest innovations in analog and logic semiconductor technologies and outlined its blueprint for upcoming technological advancements at its inaugu…
三星电子 · 半导体官方新闻 Samsung Electronics’ Industry-First LPCAMM Ushers in Future of Memory Modules
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first Low Power Compression Attached Memory Module (LPCAMM) form factor, which is expected to transform the DRAM1 marke…
三星电子 · 半导体官方新闻 Samsung Electronics’ 4TB SSD 990 PRO Series Brings Ultimate Performance and Capacity for Gamers and Creators
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of a new 4-terabyte (TB) offering in its SSD 990 PRO series. The 990 PRO series is a lineup of high-performance PCIe1 4.0 SSDs powered by Samsun…