Q3 2026 Earnings Conference Call Access Details
原文摘录：Please use the link below to access the conference call. Email verification is required. https://irsvc.teletogether.com/hynix/hynix2026Q3_eng.php
搜索“CES”
找到 68 条 · 更新于 01:41
SK海力士 · 官方新闻 SK海力士 · 官方新闻 SK hynix Announces 3Q26 Financial Results
原文摘录：▪ Reports revenues of 104.6155 trillion won, operating profit of 83.3338 trillion won, net profit of 39.7756 trillion won; Quarterly sales surpass 100 trillion won for the first time ▪ CEO Kwak Noh-Jung explains the background to the decis…
三星电子 · 半导体官方新闻 Samsung Announces Work With Qualcomm To Support Premium In-Vehicle Infotainment and Advanced Driver Assistance Systems
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the successful qualification of Samsung’s automotive LPDDR4X memory for use with the Snapdragon® Digital Chassis™ from Qualcomm Technologies, Inc. The LPD…
三星电子 · 半导体官方新闻 Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Netwo…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer…
三星电子 · 半导体官方新闻 Samsung Electronics Announces Successful Building of Industry-First CXL Infrastructure Certified by Red Hat
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully built a Compute Express Link™ (CXL™) infrastructure certified by Red Hat, the world’s leading…
三星电子 · 半导体官方新闻 Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry’s Latest GAA Process…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This init…
三星电子 · 半导体官方新闻 Samsung Electronics Introduces ISOCELL Zoom Anyplace & E2E AI Remosaic Solutions for the 200-Megapixel Image Sensor
原文摘录：Samsung Electronics first launched its 200-Megapixel (MP) Image Sensor in 2021. Since then, the company has been leading the ultra-high-megapixel industry by continuously launching new products and working tirelessly to drive further innov…
三星电子 · 半导体官方新闻 Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer proc…
美联储 · 货币政策 Federal Reserve announces the leadership and objectives of its task forces to advance the conduct of monetary policy
原文摘录：Federal Reserve announces the leadership and objectives of its task forces to advance the conduct of monetary policy
SK海力士 · 官方新闻 [AI Infrastructure Insight] How AI infrastructure will be designed for the future
原文摘录：AI is no longer defined by a single model or AI processor. For AI to operate effectively in real-world services and industrial applications, it takes faster compute, wider memory bandwidth, higher-performance networks, more efficient stora…
SK海力士 · 官方新闻 [AI Ecosystem] The semiconductor paradigm shifts toward memory
原文摘录：As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now h…
SK海力士 · 官方新闻 [AI Ecosystem] Redesigning infrastructure: Why architecture determines performance
原文摘录：As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now h…
三星电子 · 半导体官方新闻 Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). With industry-leading speeds…
三星电子 · 半导体官方新闻 Samsung Electronics and Red Hat Partnership To Lead Expansion of CXL Memory Ecosystem With Key Milestone
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link™ (CXL™) memory operations in a real user environment with open-so…
NVIDIA · 投资者关系精选 英伟达 2027 财年第二季度营收 962 亿美元，同比增长 106%
英伟达披露，截至 2026 年 7 月 26 日的季度营收为 962 亿美元，环比增长 18%；数据中心营收为 890 亿美元，同比增长 117%。公司称下一次季度股息为每股 0.25 美元。财年标签为 2027，报告期实际结束于 2026 年，金额口径为美元。
推荐理由：初始精选 · 已核对官方原文，摘要整理于 2026-10-01。原文发布日期精确到天。
SK海力士 · 官方新闻 [Tech Note] Why does AI still have to wait with tens of thousands of GPUs? How silicon photonics and CPO are building t…
原文摘录：AI doesn’t wait. The foundations of every industry are already cracking. This isn’t a story about one sector. Manufacturing. Finance. Healthcare. Data centers. The entire industrial order is being rebuilt around AI — and it’s happening now…
东京电子 · 官方新闻 Tokyo Electron Technology Solutions Fujii Head Office and Hosaka Office Achieve Platinum Status in RBA VAP
原文摘录：Tokyo Electron Technology Solutions Fujii Head Office and Hosaka Office (Yamanashi Prefecture, Japan) have earned Platinum Status, the highest recognition available, under the Responsible Business Alliance (RBA) * Validated Assessment Prog…
Rapidus · 官方新闻 Rapidus and HCLTech announce partnership for next-generation semiconductor technologies
原文摘录：UPDATE: 2026.10.26 Information TOKYO and NOIDA, India, Oct. 26, 2026: HCLTech , a leading global technology company, and Rapidus Corporation , a Japanese company developing and manufacturing advanced logic semiconductors, today officially…
SK海力士 · 官方新闻AI 评分4242 SK海力士在OCP全球峰会2026展示下一代AI基础设施愿景：以内存为中心的服务器系统
SK海力士在OCP全球峰会2026（12日至15日于加州圣何塞举行）展示面向服务器的下一代内存解决方案，并提出以CXL池化内存为基础的下一代服务器系统。其CMM-DDR5第二代产品（256GB，基于CXL 3.2）带宽较上一代提升逾一倍至80GB/s，能效提升约30%。SK海力士还与NAVER Cloud等合作，在PoC层面验证了智能体AI环境下的KV缓存共享等方案。
SK海力士 · 官方新闻 [Inside the Research] In the AI era, NAND moves beyond storage to computing… 3D FeNAND co-optimization at IEEE
原文摘录：SK hynix offers a full-stack portfolio of AI memory solutions optimized for AI systems across all major memory categories, including High Bandwidth Memory(HBM), DRAM, and NAND flash. To highlight the research that underpins these solutions…
美联储 · 货币政策 Minutes of the Board's discount rate meetings on August 17, September 9, and September 16, 2026
原文摘录：Minutes of the Board's discount rate meetings on August 17, September 9, and September 16, 2026
东京电子 · 官方新闻 TEL Manufacturing and Engineering of America achieves Platinum Status in RBA VAP
原文摘录：TEL Manufacturing and Engineering of America (Chaska, Minnesota, U.S.A.) has earned Platinum Status, the highest recognition available under the Responsible Business Alliance (RBA)* Validated Assessment Program (VAP), with a perfect score…
Rapidus · 官方新闻 Rapidus Unveils “Rapidus CORE”, New Global Ecosystem Framework Supporting the Development and Mass Production of Cuttin…
原文摘录：UPDATE: 2026.10.05 Information TOKYO, Oct. 5, 2026 – Rapidus Corporation today announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass product…
SK海力士 · 官方新闻 From identifying promising technologies to creating new business opportunities: How SK hynix Ventures finds the path fo…
原文摘录：Identifying promising technologies early and investing in them is one challenge. Turning those technologies into businesses is another. That requires assessing what problems a technology can solve, refining it with research and development…
三星电子 · 半导体官方新闻 Samsung To Invest USD 1 Billion in AI Infrastructure Company Helix
原文摘录：Samsung Electronics, Samsung C&T, Samsung SDS, Samsung SDI, Samsung Life Insurance and Samsung Fire & Marine Insurance today announced they are investing a combined USD 1 billion in Helix Digital Infrastructure, an AI infrastructure compan…
三星电子 · 半导体官方新闻AI 评分4040 三星电子与Mistral AI宣布战略合作，推进智能驱动半导体基础设施
三星电子宣布与Mistral AI达成战略合作，将在半导体业务中引入Mistral AI服务及旗舰大语言模型Mistral Large，开发定制化本地部署AI模型。三星还将把针对性AI模型应用于缺陷检测和设备优化，以加速先进存储与逻辑芯片的开发周期、制造精度和良率稳定。三星同时领投了Mistral AI的D轮融资，获得战略股权以支持长期技术合作。
三星电子 · 半导体官方新闻 Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
原文摘录：Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next…
三星电子 · 半导体官方新闻 Samsung Showcases P9 and P7 SSDs Featuring USB4 at Gamescom 2026
原文摘录：Samsung Electronics a global leader in advanced memory technology, today unveiled the P9 and P7, its next-generation portable solid-state drives (SSDs) featuring USB4 connectivity. The company introduced the new P Series at Gamescom 2026,…
三星电子 · 半导体官方新闻 Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterpris…
三星电子 · 半导体官方新闻 Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
原文摘录：Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MO…
Rapidus · 官方新闻 Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design ～Collaboration combines Rapidus’ AI-Agentic Design So…
原文摘录：UPDATE: 2026.07.17 Information TOKYO and SAN JOSE, Calif., July 16, 2026 —Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the…
三星电子 · 半导体官方新闻 Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure
原文摘录：Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments. As…
三星电子 · 半导体官方新闻 Samsung Unveils Industry’s Fastest UFS 5.0 Solution for Next-Gen On-Device AI Applications
原文摘录：Samsung Electronics, the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamle…
Rapidus · 官方新闻AI 评分2222 Rapidus与意大利Fondazione Chips-IT签署半导体制造合作备忘录
Rapidus于6月16日宣布与意大利半导体设计基金会Fondazione Chips-IT签署谅解备忘录，为日本政府与意大利之间的合作提供框架。日本首相Sanae Takaichi于6月15日访意与意大利总理Giorgia Meloni会面推进双边科技合作，该备忘录为此倡议的一部分。Rapidus目前正进行试产，目标2027年在日本量产尖端2nm逻辑半导体。
Rapidus · 官方新闻 Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor ManufacturingNew collaboration provides framewo…
原文摘录：UPDATE: 2026.06.15 Information TOKYO, June 15, 2026 – Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in t…
三星电子 · 半导体官方新闻精选AI 评分6262 三星电子开始出货业界首款HBM4E样品
三星电子宣布已开始向主要全球客户出货业界首款12层HBM4E样品，并计划在样品出货和优化后按客户时间表启动量产。该产品引脚速度稳定为14Gbps、可扩展至16Gbps，较HBM4提升逾20%，单堆栈带宽最高3.6TB/s，12层容量48GB、较上一代增加逾30%，并计划按客户需求扩展32GB（8层）和64GB（16层）配置。
推荐理由：三星披露HBM4E样品出货及速度、容量、能效等参数，可观察下一代HBM产品阶段与量产节奏。
Rapidus · 官方新闻 Rapidus Opens Analysis Center and Rapidus Chiplet SolutionsNew facilities enhance Rapidus’ development environment to e…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
Rapidus · 官方新闻 NEDO Approves Rapidus’ FY2026 Plan and Budget for 2nm Semiconductor Projects Approval covers “Research and Development…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
三星电子 · 半导体官方新闻精选AI 评分6060 三星与AMD签署谅解备忘录，扩大下一代AI存储合作
三星电子宣布与AMD签署谅解备忘录，扩大在下一代AI存储与计算技术上的战略合作。根据备忘录，双方将就下一代AMD AI加速器Instinct MI455X GPU的主要HBM4供应，以及代号“Venice”的第6代AMD EPYC CPU所用先进DRAM方案进行对接。
推荐理由：三星与AMD签署谅解备忘录，明确HBM4与DDR5供应方向并提及代工合作讨论，可观察AI存储供应链的绑定进展与阶段约束。
三星电子 · 半导体官方新闻 Samsung Unveils HBM4E, Showcasing Comprehensive AI Solutions, NVIDIA Partnership and Vision at NVIDIA GTC 2026
原文摘录：Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’…