原文摘录：AI doesn’t wait. The foundations of every industry are already cracking. This isn’t a story about one sector. Manufacturing. Finance. Healthcare. Data centers. The entire industrial order is being rebuilt around AI — and it’s happening now…
原文摘录：Please use the link below to access the conference call. Email verification is required. https://irsvc.teletogether.com/hynix/hynix2026Q3_eng.php
原文摘录：▪ Reports revenues of 104.6155 trillion won, operating profit of 83.3338 trillion won, net profit of 39.7756 trillion won; Quarterly sales surpass 100 trillion won for the first time ▪ CEO Kwak Noh-Jung explains the background to the decis…
原文摘录：Tokyo Electron Technology Solutions Fujii Head Office and Hosaka Office (Yamanashi Prefecture, Japan) have earned Platinum Status, the highest recognition available, under the Responsible Business Alliance (RBA) * Validated Assessment Prog…
原文摘录：UPDATE: 2026.10.26 Information TOKYO and NOIDA, India, Oct. 26, 2026: HCLTech , a leading global technology company, and Rapidus Corporation , a Japanese company developing and manufacturing advanced logic semiconductors, today officially…
原文摘录：AI is no longer defined by a single model or AI processor. For AI to operate effectively in real-world services and industrial applications, it takes faster compute, wider memory bandwidth, higher-performance networks, more efficient stora…
原文摘录：Dear All, SK hynix Inc. will present its Third quarter earnings of 2026 on October. 28th, 2026 (Wed.). Announcement of the earnings in a press release will be made before 9:00 a.m. of the day. The conference call will be
原文摘录：As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now h…
SK海力士在OCP全球峰会2026（12日至15日于加州圣何塞举行）展示面向服务器的下一代内存解决方案，并提出以CXL池化内存为基础的下一代服务器系统。其CMM-DDR5第二代产品（256GB，基于CXL 3.2）带宽较上一代提升逾一倍至80GB/s，能效提升约30%。SK海力士还与NAVER Cloud等合作，在PoC层面验证了智能体AI环境下的KV缓存共享等方案。
原文摘录：SK hynix offers a full-stack portfolio of AI memory solutions optimized for AI systems across all major memory categories, including High Bandwidth Memory(HBM), DRAM, and NAND flash. To highlight the research that underpins these solutions…
原文摘录：TEL Manufacturing and Engineering of America (Chaska, Minnesota, U.S.A.) has earned Platinum Status, the highest recognition available under the Responsible Business Alliance (RBA)* Validated Assessment Program (VAP), with a perfect score…
原文摘录：UPDATE: 2026.10.05 Information TOKYO, Oct. 5, 2026 – Rapidus Corporation today announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass product…
原文摘录：Identifying promising technologies early and investing in them is one challenge. Turning those technologies into businesses is another. That requires assessing what problems a technology can solve, refining it with research and development…
原文摘录：As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now h…
原文摘录：Samsung Electronics, Samsung C&T, Samsung SDS, Samsung SDI, Samsung Life Insurance and Samsung Fire & Marine Insurance today announced they are investing a combined USD 1 billion in Helix Digital Infrastructure, an AI infrastructure compan…
三星电子宣布与Mistral AI达成战略合作，将在半导体业务中引入Mistral AI服务及旗舰大语言模型Mistral Large，开发定制化本地部署AI模型。三星还将把针对性AI模型应用于缺陷检测和设备优化，以加速先进存储与逻辑芯片的开发周期、制造精度和良率稳定。三星同时领投了Mistral AI的D轮融资，获得战略股权以支持长期技术合作。
原文摘录：Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today unveiled the P9 and P7, its next-generation portable solid-state drives (SSDs) featuring USB4 connectivity. The company introduced the new P Series at Gamescom 2026,…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterpris…
原文摘录：Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MO…
原文摘录：UPDATE: 2026.07.17 Information TOKYO and SAN JOSE, Calif., July 16, 2026 —Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the…
原文摘录：As part of the development of Agentic AI and Robotics solutions, Tokyo Electron(TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) is collaborating with NVIDIA, utilizing NVIDIA Agent Toolkit including NVIDIA NeMo, NVIDIA NIM, N…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments. As…
原文摘录：Samsung Electronics, the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamle…
原文摘录：UPDATE: 2026.06.15 Information TOKYO, June 15, 2026 – Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in t…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
原文摘录：Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the indu…
原文摘录：Samsung Electronics today announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing. By deploying more t…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has developed the industry’s first 24-gigabit (Gb) GDDR71 DRAM. In addition to the industry’s highest capacity, the GDDR7 features the fastest speed, p…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of the 990 EVO Plus, adding to its lineup of leading SSD products. With PCIe 4.0 support and latest NAND technology, the 990 EVO Plus is an id…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). With industry-leading speeds…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass productio…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the successful qualification of Samsung’s automotive LPDDR4X memory for use with the Snapdragon® Digital Chassis™ from Qualcomm Technologies, Inc. The LPD…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leaders…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung’s eighth-generation V-NAND (V8) technology, the…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully built a Compute Express Link™ (CXL™) infrastructure certified by Red Hat, the world’s leading…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s D…