原文摘录：As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now h…
原文摘录：Samsung Electronics, Samsung C&T, Samsung SDS, Samsung SDI, Samsung Life Insurance and Samsung Fire & Marine Insurance today announced they are investing a combined USD 1 billion in Helix Digital Infrastructure, an AI infrastructure compan…
三星电子宣布与Mistral AI达成战略合作，将在半导体业务中引入Mistral AI服务及旗舰大语言模型Mistral Large，开发定制化本地部署AI模型。三星还将把针对性AI模型应用于缺陷检测和设备优化，以加速先进存储与逻辑芯片的开发周期、制造精度和良率稳定。三星同时领投了Mistral AI的D轮融资，获得战略股权以支持长期技术合作。
原文摘录：Samsung Electronics and ASML today announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today unveiled the P9 and P7, its next-generation portable solid-state drives (SSDs) featuring USB4 connectivity. The company introduced the new P Series at Gamescom 2026,…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterpris…
原文摘录：Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MO…
原文摘录：UPDATE: 2026.07.17 Information TOKYO and SAN JOSE, Calif., July 16, 2026 —Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the…
原文摘录：As part of the development of Agentic AI and Robotics solutions, Tokyo Electron(TEL; Head Office: Minato-ku, Tokyo; President: Toshiki Kawai) is collaborating with NVIDIA, utilizing NVIDIA Agent Toolkit including NVIDIA NeMo, NVIDIA NIM, N…
原文摘录：Samsung Electronics a global leader in advanced memory technology, today announced mass production of PM1763, the company’s PCIe® 6.0-based enterprise solid state drive (SSD) optimized for next-generation AI and HPC server environments. As…
原文摘录：Samsung Electronics, the world leader in advanced memory technology today announced that, for the first time in the industry, it has developed the industry’s fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamle…
原文摘录：UPDATE: 2026.06.15 Information TOKYO, June 15, 2026 – Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconductor Centre (UKSC), a national body promoting the semiconductor industry in t…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11 2026 – Rapidus Corporation today announced that it opened an Analysis Center and its Rapidus Chiplet Solutions (RCS). The Analysis Center is a facility adjacent to Rapidus’ Innovative Integrat…
原文摘录：UPDATE: 2026.04.11 Information TOKYO, April 11, 2026 – Rapidus Corporation today announced that its plans and budget for fiscal year 2026 have been approved by Japan‘s New Energy and Industrial Technology Development Organization (NEDO). T…
原文摘录：Samsung Electronics, a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’…
原文摘录：Samsung Electronics, a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the indu…
原文摘录：Samsung Electronics today announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing. By deploying more t…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has developed the industry’s first 24-gigabit (Gb) GDDR71 DRAM. In addition to the industry’s highest capacity, the GDDR7 features the fastest speed, p…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of the 990 EVO Plus, adding to its lineup of leading SSD products. With PCIe 4.0 support and latest NAND technology, the 990 EVO Plus is an id…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). With industry-leading speeds…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass productio…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the successful qualification of Samsung’s automotive LPDDR4X memory for use with the Snapdragon® Digital Chassis™ from Qualcomm Technologies, Inc. The LPD…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leaders…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung’s eighth-generation V-NAND (V8) technology, the…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully built a Compute Express Link™ (CXL™) infrastructure certified by Red Hat, the world’s leading…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s D…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in th…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed the industry’s first LPDDR5X DRAM supporting the industry’s highest performance of up to 10.7 gigabits-per-second (Gbps). Leveraging 1…
原文摘录：Samsung Electronics, the world leader in advanced memory technology, today announced that it has started sampling its 256-gigabyte (GB)1 SD Express2 microSD card with sequential read speed of up to 800 megabytes per second (MB/s) and has c…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung’s HBM3E 12H provides an all-…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This init…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced the release of SSD 990 EVO — the newest addition to the company’s lineup of consumer SSDs — which delivers powerful performance with better energy efficienc…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today announced that for the first time in the industry, it has successfully verified Compute Express Link™ (CXL™) memory operations in a real user environment with open-so…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new ISOCELL Vizion sensors — a time-of-flight (ToF) sensor, the ISOCELL Vizion 63D and a global shutter sensor, the ISOCELL Vizion 931. First in…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today unveiled the T5 EVO, a lightweight portable Solid-State Drive (SSD) that provides up to 8 terabytes (TB) of capacity, which is the largest capacity size curren…
原文摘录：Samsung Electronics today opened the Samsung AI Forum, at which it shared the latest research achievements in artificial intelligence (AI) and computer engineering (CE), contributing to enhancing the company’s next-generation semiconductor…
原文摘录：Samsung Electronics first launched its 200-Megapixel (MP) Image Sensor in 2021. Since then, the company has been leading the ultra-high-megapixel industry by continuously launching new products and working tirelessly to drive further innov…
原文摘录：Samsung Electronics, a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — i…
原文摘录：Samsung Electronics, a world leader in advanced semiconductor technology, today hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer proc…